新加坡采购需求：碳化硅涂层，碳化钽涂层，碳化硅陶瓷，半导体元件，中国制造商，供应商

We are currently working on the development of an innovative Laser-assisted reflow bonder (LAB) machine tailored for the advanced packaging semiconductor industry. As part of our research, we are exploring the possibility of positioning our IR diode laser from below to effectively reflow the solder between the wafer die and the panel. This requires a high-quality Quartz material to serve as our chuck. Could you please provide us with information on any Quartz solutions you might offer that would meet our specific requirements? We're particularly interested in discussing properties, specifications, and availability of the material. Looking forward to hearing from you soon!